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The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing. Werner Kern developed the basic procedure in 1965 while working for RCA, the Radio Corporation of America.〔(''RCA Clean'', materials at Colorado School of Mines )〕〔W. Kern and D. A. Puotinen: RCA Rev. 31 (1970) 187.〕 It involves the following chemical processes performed in sequence: # Removal of the organic contaminants (organic clean + particle clean) # Removal of thin oxide layer (oxide strip, optional) # Removal of ionic contamination (ionic clean) == Standard recipe == The wafers are prepared by soaking them in DI water. If they are grossly contaminated (visible residues), they may require a preliminary cleanup in Piranha solution. The steps below are carried out by immersing the wafers in solutions prepared in fused silica or fused quartz vessels (borosilicate glassware must not be used, as its impurities leach out and cause contamination). The wafers are thoroughly rinsed with deionized water between each step.〔 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「RCA clean」の詳細全文を読む スポンサード リンク
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